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New semiconductor material investigated



 
 
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Old November 27th 20, 01:34 PM posted to rec.photo.digital
-hh
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Posts: 838
Default New semiconductor material investigated

On Thursday, November 26, 2020 at 12:40:36 AM UTC-5, RichA wrote:
On Wednesday, 25 November 2020 at 19:00:44 UTC-5, -hh wrote:
On Wednesday, November 25, 2020 at 12:38:35 PM UTC-5, Alfred Molon wrote:
In article ,
says...

On 25/11/2020 4:41 pm, -hh wrote:
On Tuesday, November 24, 2020 at 4:42:16 PM UTC-5, geoff wrote:
Sounds promising.

https://tinyurl.com/yxt5j7l7

It will find a niche somewhere, but don?t expect it to show up in consumer
products for quite awhile. For example, GaAs and GaN have both been
around for over a decade and their applications are still quite spotty:
compared to classical silicone, the wafers are smaller & more expensive,
plus you can easily blow through a couple Million just to optimize one?s
manufacturing to get yields up.

GaAs LEDs have existed for nearly 60 years.

But Gallium is a quite rare element (especially if compared to
silicon). Probably also much more expensive.

He’s missing the point, which is just because a material exists
doesn’t mean that it will “take over” the entire industry...and his
own “GaAs LED” claim confirms this perspective.

FWIW, one of the problems that GaAs has had which have hindered
semiconductor designs is the medium still has uniformity problems
with voids..it progressively trashes the wafer yield as one’s product
size increases. GaN is better in this regards, but its wafers are even
more expensive...it was used a few years back in a ‘DARPA Challenge’
program... think it was for a 10Gbps+ wireless link? Guy I knew who
was working on it does of a heart attack, so I’ve lost track...




You frequent sites like phys.org. They have a DOZEN stories a day about glad
new breakthroughs in technology and almost none of them ever come to anything.


No, for it depends on your timeline of perspective, Rich. For example, I've mentioned
the feasibility of TPG for high performance thermal management systems in electronics
more than a few years ago now, but the commercial need for that level of performance
that's permanently leakproof just hasn't come about in the consumer electronics market
for it to reach your level of visibility.

Some major ones are increases in solar cell efficiency and new, better batteries. Even
if materials do show real promise, there are too often technological, economic and
even political pressures working against progress. Some of them are worthless from the start.


A lot of the trip-up at present seems to be from people believing that the hard work begins
and ends with the laboratory science, thereby forgetting the engineering and manufacturing
aspects. That's where a lot of the recent battery work has hit "brick walls". The above comment
on voids in GaAs is a perfect example: its pretty straightforward to take a wafer mask and fab
a couple hundred chips and then sort through them for five good ones ... but its another thing
entirely to figure out what to do about the voids so that you don't make chips at void sites so that
you can get yields that make the chips affordable enough to broadly use.

FWIW, one manufacturing tech project I worked on a few years ago took a "proven" chip design and
went through its fab process steps ... in the end, we got the yield up from IIRC 8% to ~50% while
also tightening up some performance parameters, dropping the price per chip from the $130 range
down to ~$9.


-hh
 




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